Factory Lead Time  

21 Weeks

Contact Plating  

Copper, Silver, Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

100-TFBGA

Number of Pins  

100

Data Converters  

A/D 15x10/12b; D/A 2x12b

Number of I/Os  

79

Watchdog Timers  

Yes

Operating Temperature  

-40°C~85°C TA

Packaging  

Tray

Series  

SAM3S

Published  

1997

JESD-609 Code  

e1

Pbfree Code  

yes

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

100

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Supply Voltage  

1.8V

Terminal Pitch  

0.8mm

Frequency  

64MHz

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

ATSAM3S1

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

1.95V

Power Supplies  

1.83.3V

Interface  

I2C, I2S, SPI, UART, USART, USB

Memory Size  

64kB

Oscillator Type  

Internal

RAM Size  

16K x 8

Voltage - Supply (Vcc/Vdd)  

1.62V~3.6V

uPs/uCs/Peripheral ICs Type  

MICROCONTROLLER, RISC

Core Processor  

ARM® Cortex®-M3

Peripherals  

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Program Memory Type  

FLASH

Core Size  

32-Bit

Program Memory Size  

64KB 64K x 8

Connectivity  

EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB

Bit Size  

32

Has ADC  

YES

DMA Channels  

YES

Data Bus Width  

32b

PWM Channels  

YES

DAC Channels  

YES

Number of Timers/Counters  

6

Address Bus Width  

24

Core Architecture  

ARM

CPU Family  

CORTEX-M3

Length  

9mm

Height Seated (Max)  

1.1mm

REACH SVHC  

No SVHC

RoHS Status  

ROHS3 Compliant